Internship: software developer with ai/ml focus for chip-package-board codesign (f/m/div)
VillachInfineon Technologies AG
...AI/ML algorithms to enhance automation and efficiency in Electronic Design Automation (EDA) workflows and improve Chip-Package-Board CoDesign methodologiesDevelop software solutions using Python, Java, and Cadence SKILL within the EDA framework to support advanced semiconductor design challengesAnalyze data [...]
Kategorie Recht